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  cystech electronics corp. spec. no. : c337sb issued date : 2005.12.07 revised date :2010.11.29 page no. : 1/7 sk520sb-sk5100sb cystek product specification 5.0amp. surface mount schottky barrier diodes sk520sb thru sk5100sb features ? for surface mounted applications. ? for use in low voltage, high frequency inverters, free wheeling, and polarity protection applications ? plastic material used carries underwriters laboratory flammability classification 94v-0 ? low leakage current ? high surge capability ? exceeds environmental standards of mil-s-19500/228 mechanical data ? case: molded plastic, smb/jedec do-214aa. ? terminals: solder plated, solderable per mil-std-750 method 2026 ? polarity: indicated by cathode band. ? mounting position : any. ? weight: 0.0878 gram maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise specified. ) type parameter symbol sk 520 sk 530 sk 540 sk 550 sk 560 sk 580 sk 5100 units repetitive peak reverse voltage v rrm 20 30 40 50 60 80 100 v maximum rms voltage v rms 14 21 28 35 42 56 70 v maximum dc blocking voltage v r 20 30 40 50 60 80 100 v maximum instantaneous forward voltage, i f =5a (note 1) v f 0.55 0.55 0.55 0.7 0.7 0.85 0.85 v average forward rectified current i o 5 a peak forward surge current @8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 150 a maximum dc reverse current v r =v rrm ,t a =25 (note) v r =v rrm ,t a =125 (note) i r 0.5 50 ma ma maximum thermal resistance, junction to lead r th,jl 12 (typ) /w diode junction capacitance @ f=1mhz and applied 4vdc reverse voltage c j 380(typ) pf storage temperature tstg -55 ~ +150 operating temperature t j -55 ~ +125 -55 ~ +150 notes : pulse test, pulse width=300 sec, 2% duty cycle
cystech electronics corp. spec. no. : c337sb issued date : 2005.12.07 revised date :2010.11.29 page no. : 2/7 sk520sb-sk5100sb cystek product specification characteristic curves forward current derating curve 0 1 2 3 4 5 6 0 50 100 150 200 ambient temperature---t a () average forward current---io(a) sk550-sk5100 sk520-sk540 maximum non-repetitive forward surge current 0 20 40 60 80 100 120 140 160 11 0 number of cycles at 60hz peak forward surge current---i fsm (a) 1 0 0 t j =25 , 8.3ms sin g le hal f sine wave jedec method forward current vs forward voltage 0.01 0.1 1 10 100 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 forward voltage---v f (v) forward current---i f (a) tj=25, pulse width=300s, 1% duty cycle sk520-sk540 sk550-sk560 SK580-sk5100 junction capacitance vs reverse voltage 0 200 400 600 800 1000 1200 1400 0.01 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 percent of rated peak reverse voltage---(%) reverse leakage current---i r (ma) tj=75 tj=25
cystech electronics corp. spec. no. : c337sb issued date : 2005.12.07 revised date :2010.11.29 page no. : 3/7 sk520sb-sk5100sb cystek product specification taping reel dimension
cystech electronics corp. spec. no. : c337sb issued date : 2005.12.07 revised date :2010.11.29 page no. : 4/7 sk520sb-sk5100sb cystek product specification recommended wave soldering profile
cystech electronics corp. spec. no. : c337sb issued date : 2005.12.07 revised date :2010.11.29 page no. : 5/7 sk520sb-sk5100sb cystek product specification recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c337sb issued date : 2005.12.07 revised date :2010.11.29 page no. : 6/7 sk520sb-sk5100sb cystek product specification recommended footprint inches millimeters dim typ typ a 0.142 3.60 b 0.059 1.50 c 0.118 3.00 ordering information device package shipping marking sk520sb smb 3000 pcs / tape & reel ss52 sk530sb smb 3000 pcs / tape & reel ss53 sk540sb smb 3000 pcs / tape & reel ss54 sk550sb smb 3000 pcs / tape & reel ss55 sk560sb smb 3000 pcs / tape & reel ss56 SK580sb smb 3000 pcs / tape & reel ss58 sk5100sb smb 3000 pcs / tape & reel s510
cystech electronics corp. spec. no. : c337sb issued date : 2005.12.07 revised date :2010.11.29 page no. : 7/7 sk520sb-sk5100sb cystek product specification do-214aa/smb dimension do-214aa/smb plastic surface mounted package cystek package code : sb *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.076 0.082 1.93 2.08 e 0.006 0.012 0.15 0.31 b 0.137 0.147 3.48 3.73 f 0.004 0.008 0.10 0.20 c 0.167 0.187 4.25 4.75 g 0.035 0.056 0.90 1.41 d 0.078 0.103 1.99 2.61 h 0.207 0.215 5.26 5.46 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .


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